Bernstein Report Highlights AI Data Center Connectivity as New Bottleneck

According to PANews, a comprehensive 97-page report by Bernstein has identified connectivity in AI data centers as the new bottleneck, replacing computing power. The report suggests that copper and optical interconnections will coexist in the long term. While the direction for Co-Packaged Optics (CPO) is clear, large-scale deployment is not expected until after 2028. More certain performance in 2026 is anticipated in areas such as Printed Circuit Boards (PCB), Ajinomoto Build-up Film (ABF), and Low Power Optics/Non-Power Optics (LPO/NPO).