STOCKS | Micron Plans to Double HBM Capacity by Year-End

Micron plans to double its high-bandwidth memory, or HBM, capacity from last year and is pushing aggressive equipment investment before year-end to strengthen supply of its next-generation HBM4 12-layer products. According to Sina Finance, the company aims to add up to 60,000 wafers a month to HBM capacity by the end of this year, with monthly output expected to reach about 100,000 wafers by year-end. According to Sina Finance, a person familiar with the matter said Micron is carrying out large-scale equipment investment to rapidly expand HBM4 capacity. Micron is also increasing purchase orders with multiple HBM manufacturing equipment suppliers, and equipment is continuing to arrive at its HBM production base. The share of HBM4 12-layer output is expected to rise sharply. At present, most of Micron's HBM output is HBM3E 12-layer products. Earlier this year, HBM4 12-layer products accounted for 20% to 30% of total output, and that share is reportedly expected to rise to as much as 50% by year-end. HBM4 12-layer products will be used in Nvidia's Vera Rubin AI chip, and Micron began mass production of the products in the second quarter of this year.