TrendForce: MLCC Book-to-Bill Hits Record Highs at Murata, Samsung Electro-Mechanics and Taiyo Yuden

Murata, Samsung Electro-Mechanics and Taiyo Yuden posted record-high MLCC book-to-bill (BB) ratios in late June 2026 at 1.30, 1.31 and 1.25, respectively, while the overall MLCC market BB ratio rose to 1.04, according to Jiemian News citing TrendForce research. Murata’s fiscal Q1 2026 results showed its orders-to-backlog ratio reached 1.27, above the 1.25 peak seen at the start of the 2018 MLCC shortage, indicating rapidly rising backlog pressure and higher supply-shortage risk. TrendForce attributed the demand strength to faster AI server upgrades and continued volume ramp-up of in-house ASIC chips by cloud service providers (CSPs). On the supply side, TrendForce said tightness in high-end AI MLCCs is spilling over into automotive and consumer segments, with Apple’s supply chain starting inventory preparation 1–2 months earlier than last year and automotive ODMs moving procurement forward from July to May.