Samsung Electro-Mechanics and Qualcomm Co-Develop Organic Bridge Packaging for AI Chips

Samsung Electro-Mechanics is jointly developing an “organic bridge” technology for advanced AI chip packaging with Qualcomm, and the two companies have been working on research and verification for more than a year, according to Jiemian News. Samsung Electro-Mechanics is also developing 2.1D packaging substrates based on the organic bridge with other customers. The company plans to embed the organic bridge, with five to seven redistribution layers, into FC-BGA substrates and aims to reduce line width and spacing to 1.5 to 2 microns. The technology is seen as a potential alternative to Intel’s EMIB silicon bridge packaging.