Lanqi Technology Plans to Complete Engineering Development of Third-Generation MRCD/MDB Chips This Year

Lanqi Technology said it planned to complete the engineering development of its third-generation MRCD/MDB chips this year. According to Jin10, the company said during a survey with specific participants that it is a leading organizer in drafting international standards for MDB chips, and that it has driven related technological innovation while maintaining an industry-leading position. The company said it launched its second-generation MRCD/MDB chips in January 2025, and that shipments rose significantly over the most recent two quarters. It added that its products have been recognized by major global memory module manufacturers for performance and stability, laying a foundation for subsequent industry-scale volume growth. Lanqi Technology said the planned engineering development of third-generation MRCD/MDB chips is intended to further consolidate its technological lead.