AI TRENDS | BOE A Highlights Glass-Based Packaging Substrates, Perovskite, and MicroLED Optical Interconnects as Growth Areas

BOE A said it is expanding into glass-based packaging substrates, perovskite, and MicroLED optical interconnect-related applications as key directions for future business development. According to Jin10, the company made the remarks during an institutional survey, citing three core strengths built up over years: display technology, glass-based processing capabilities, and large-scale integrated intelligent manufacturing. BOE A said its “Screen IoT” strategy, guided by its “Nth curve” theory, is driving the reuse of these capabilities to support the new布局 in the above areas.