BOE Technology Clarifies Misinterpretations on Corning Collaboration

BOE Technology Group Co., Ltd. announced on May 21, 2026, that it has disclosed a memorandum of understanding with Corning Incorporated. According to Jin10, the announcement has attracted significant market attention, leading to some external misinterpretations. The company emphasized the risks associated with its glass-based packaging substrate, perovskite, and optical interconnect businesses, which are still in the technical exploration and validation stages. These projects have not yet reached mass production or generated revenue from mass production. There is significant uncertainty regarding whether and when the company will achieve mass production and realize expected benefits in these areas. Based on current business development, it is anticipated that these businesses will not significantly impact the company's operating performance in the next 2-3 years. As of now, BOE Technology has not initiated any business cooperation with NVIDIA, and some media speculations lack factual basis.