AI TRENDS | Copper Foil Maker Says HVLP4 Orders Extend to Late 2027

A domestic copper foil manufacturer’s marketing head said the company’s HVLP fourth-generation computing-power copper foil, used for AI servers and high-speed optical modules, has orders booked through the second half of 2027. According to Jin10, the executive said copper foil producers typically start with RTF products and then upgrade step by step to HVLP generations 1–2 and 3–4. Each generation requires a verification cycle of 6 to 12 months, and the full process involves 1 to 3 years of system-level certification. The executive added that overseas chipmakers such as Nvidia, AMD, and Intel, as well as domestic vendors including Huawei Ascend, impose strict requirements on copper foil generation standards, and that only a small number of leading companies worldwide are certified.