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Tentang BONKGROK

Bonk Grok (BONKGROK) adalah mata uang kripto yang diluncurkan pada 2024. BONKGROK memiliki persediaan saat ini sebesar 1.00Bn dengan 0 yang beredar. Harga BONKGROK terakhir yang diketahui adalah 0 USD dan 0 selama 24 jam terakhir. Saat ini diperdagangkan di pasar aktif dengan $0 diperdagangkan selama 24 jam terakhir. Informasi lebih lanjut dapat ditemukan di .
BONKGROK Statistik Harga
BONKGROK Harga Hari Ini
Perubahan Harga 24 jam
-$00.00%
Volume 24 jam
$00.00%
Rendah 24 jam / Tinggi 24 jam
$0 / $0
Volume / Kap Pasar
--
Dominasi Pasar
0.00%
Peringkat pasar
#12132
BONKGROK Kapitalisasi Pasar
Kapitalisasi Pasar
$0
Kapitalisasi Pasar Terdilusi Penuh
$2,780.56
BONKGROK Riwayat Harga
7d Rendah / Tinggi 7d
$0 / $0
Tertinggi Sepanjang Masa
$0
Terendah sepanjang masa
$0
BONKGROK Pasokan
Pasokan yang Beredar
0
Jumlah Pasokan
1.00Bn
Pasokan Maks
1.00Bn
Diperbarui Sep 02, 2026 3:04 sore
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BONKGROK
Bonk Grok
$0
$0(-0.00%)
MCap $0
Tidak ada apa-apa di sini.
TSMC Expected to Keep Using Microbumps for HBM Packaging in the Near Term
TSMC Expected to Keep Using Microbumps for HBM Packaging in the Near Term
TSMC is expected to continue using conventional microbump technology rather than hybrid bonding for advanced packaging that connects high-bandwidth memory, or HBM, with AI accelerators, according to materials industry sources cited on September 2. According to ChainCatcher, finer-pitch microbumps are expected to remain in use through the later stage of HBM4 and the early stage of HBM5. TSMC has asked materials and equipment partners to develop bonding and underfill solutions for bumps of about 5 microns, with suppliers in South Korea and Japan already working on the effort. Mass production of 5-micron bumps is expected to begin in the second half of 2028. Current HBM3E bumps are about 15 to 25 microns high, while HBM4 is close to 10 microns. Japanese materials suppliers had previously said it was difficult to guarantee quality below 15 microns. The smaller bump size is intended to address HBM stack height limits and the need for higher interconnect density. JEDEC sets the maximum HBM stack height at 775 microns. In TSMC's advanced CoWoS packaging, HBM stacks assembled by GPU and memory suppliers are mounted onto a silicon interposer through microbumps, while 16-layer DRAM die stacks are completed inside HBM packages by companies including SK hynix and Samsung Electronics. Hybrid bonding, which directly bonds copper pads to enable thinner and denser interconnects, is already used by TSMC on its SoIC platform for logic chip stacking, but HBM still relies on microbumps to connect to the interposer.
Sep 02, 2026 3:03 sore
STOCKS | South Korea's Kospi Falls 4.0% to End Two-Day Winning Streak
STOCKS | South Korea's Kospi Falls 4.0% to End Two-Day Winning Streak
South Korea's Kospi ended a two-day winning streak as semiconductor and auto shares fell. According to Sina Finance, the index closed down 4.0% at 6,562.72. South Korea's August inflation accelerated less than expected, but core prices rose at the fastest pace in more than three years, reinforcing the case for the Bank of Korea to keep policy tight. According to Sina Finance, consumer prices rose 3.1% from a year earlier in August, above July's 2.8% and below the median forecast of 3.2%, while core inflation climbed to 3.4% from 2.6% in July. JPMorgan said weak market sentiment and likely continued outflows from leveraged exchange-traded funds mean South Korean retail investors are unlikely to buy stocks on a large scale in the near term. According to Sina Finance, analysts Rajiv Batra and Mixo Das wrote that corporate buybacks have become another new buyer of South Korean domestic stocks, while buying from long-only funds has also started to recover. Societe Generale said South Korean retail investors are shifting from leveraged exchange-traded funds to semiconductor-related structured products, reflecting a change in investment tool preference rather than weaker demand. According to Sina Finance, strategists including Rajat Agarwal wrote that although inflows into single-stock leveraged ETFs slowed over the past six weeks, ordinary stock buying remained firm and structured product issuance rose.
Sep 02, 2026 2:59 siang

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