Samsung Electronics Plans to Double HBM4 and HBM4E Output Next Year, Analyst Says

Citrini analyst jukan said on X that Samsung Electronics expects to at least double production of HBM4 and HBM4E next year compared with this year. According to Odaily, Samsung Electronics also plans to raise outsourced cleaning of glass substrates used in HBM production from 20,000 wafers per month this year to 50,000 wafers per month next year. Samsung Electronics began mass production shipments of HBM4 in February and provided 12-layer HBM4E samples to customers including Nvidia in May. Industry estimates put Samsung Electronics' average monthly HBM wafer input at about 180,000 wafers this year, rising to about 250,000 wafers next year, while the share of HBM4-series shipments may increase from about 40% to about 80%.