ASML has secured commitments from top chipmakers to use its latest semiconductor production equipment and has launched a broader agreement to meet surging demand for more powerful AI technology. According to Sina Finance, Samsung Electronics and TSMC plan to join Intel in adopting the Dutch company’s high-numerical-aperture extreme ultraviolet lithography tools for mass production, no later than 2028 for Samsung and starting in 2030 for TSMC.
The equipment can cost as much as $400 million per unit. The four companies also agreed on an important shift in mask technology specifications, moving the current 6-inch standard to 12 inches to improve production efficiency and reduce costs.