AI TRENDS | Serenity Says Advanced AI Packaging Cycle Is Near, Shares Glass Substrate Timelines

Serenity said a new cycle in advanced AI packaging is approaching and outlined recent timelines and key participants in the glass substrate supply chain. According to Odaily, Serenity wrote on X that SKC Absolics plans mass production in the second half of 2026 and will mainly serve AMD customers, while Samsung Electro-Mechanics and Sumitomo Chemical plan mass production in the second half of 2027 and will mainly serve Apple, Broadcom, and large cloud computing companies. Serenity also said a 2–3 year forecast for TSMC’s CoPoS route has been broadly accurate, adding that Innolux is among the beneficiaries and that SHMD may also benefit, though its financial condition is relatively weak. Serenity said participants in the related supply chain could benefit multiple times, citing Innolux and SKC as examples, and added that upstream equipment suppliers are also expected to benefit from these mass production waves.