BOE A said it has delivered samples of its glass substrate products to some domestic clients, with some clients completing concept verification and moving into technical testing.
According to Jin10, BOE A made the remarks during a survey with specific participants and outlined its progress in glass substrate technology. The company said it began research into glass substrate technology in 2020.
BOE A said it invested 390 million yuan in 2022 to build a wafer-level innovation laboratory platform compatible with glass-based and silicon-based processes. It said it invested 993 million yuan in 2024 to build a panel-level glass packaging substrate pilot line, completed the installation and commissioning of major equipment within 2025, and achieved full automated equipment line connectivity in the first half of 2026.
The company said the pilot line has a designed capacity of 1,000 wafers per month. It added that it has integrated the full-process manufacturing flow for glass packaging substrates, including TGV drilling, deep-hole copper filling, build-up layers, and routing.
BOE A said it completed development and delivery of large-size, high-layer-count glass substrate samples in 2025, specifying a 9-2-9, 20-layer structure. The company said its target products are glass substrates for advanced packaging of large-size computing chips and can support different advanced packaging approaches.
BOE A said it has not yet achieved mass production and the business has not generated revenue from mass production.
Kikyo
