Samsung Allocates Over Half of 4-Nanometer Capacity to HBM4 Base Chips

Samsung Electronics’ foundry division has recently assigned more than 50% of its 4-nanometer process capacity to mass production of base chips for sixth-generation high-bandwidth memory HBM4. According to ChainCatcher, the division is expected to devote more than half of its 4-nanometer wafers to HBM4 base chip manufacturing in the second half of this year as it expands supply to Nvidia, Broadcom, and AMD. Samsung began mass shipping HBM4 in February and plans to increase supply from the third quarter, with wafer allocation rising sharply from midyear. The chip uses Samsung Foundry’s 4-nanometer SF4 process, and as of last month, more than 50% of total 4-nanometer capacity had been allocated to HBM4 base chips. People familiar with the matter said Samsung’s 4-nanometer lines are currently running at full capacity, with HBM4 base chips accounting for about 50% to 60% of output. Samsung’s Pyeongtaek Plant 2 and Plant 3 produce 4-nanometer to 7-nanometer processes, with 4-nanometer capacity estimated at about 30,000 wafers per month, implying roughly 15,000 wafers per month are being used for HBM4 base chips. At its second-quarter earnings call, Samsung said HBM4 revenue is expected to more than triple quarter on quarter in the third quarter, and HBM4 revenue in the second half will exceed 60% of the company’s total HBM revenue.