TSMC CEO Expects Significant Increase in CoPoS Production in Coming Years

According to Odaily, technology analyst @jukan05 revealed that TSMC CEO stated the company's CoPoS advanced packaging technology is currently in trial production and is expected to see a significant increase in production over the next two to three years. The CEO also mentioned that TSMC is expanding its mature process wafer capacity, including facilities in Japan to meet CMOS image sensor demand and in Germany to support automotive and industrial needs. Additionally, the company has no plans to significantly raise prices like the memory semiconductor industry, focusing instead on long-term, sustainable growth rather than short-term price hikes.