STOCKS | BOE A Achieves Full Automation on Glass-Based Packaging Substrate Pilot Line in First Half of 2026

According to Jin10, BOE A said at an investor relations event that it invested 993 million yuan in 2024 to build a board-level glass-based packaging substrate pilot line, completed the installation and debugging of major equipment in 2025, and achieved full automation on the line in the first half of 2026. The pilot line is designed for a capacity of 1,000 pieces per month and now covers the full process, including high-aspect-ratio TGV drilling, deep-hole copper filling, low-stress metal wiring, high-layer lamination, high-density wiring, and low-stress cutting, giving it complete glass substrate manufacturing capability.