AI TRENDS | CXMT Starts Small-Scale HBM3E Production For AI Chips

CXMT has begun small-scale production of HBM3E memory, an advanced high-bandwidth memory used in artificial intelligence chipsets, and plans to expand output in 2027, according to ETNet. The company is also planning to expand capacity. Its DRAM manufacturing capacity is expected to reach 350,000 wafers a month by the end of this year, with further increases planned in the coming years. CXMT's current HBM3E production remains very limited, indicating it is still in the risk trial stage. The report said CXMT has previously been able to move quickly from risk trial production to mass production, so HBM3E could enter large-scale output within weeks. The Information also reported that several Chinese chipmakers, including Alibaba's T-Head and Cambricon (SSE: 688256), are testing HBM3E compatibility with their processors. If all goes as planned, they could begin using the product in their devices as early as next year.