Micron Starts $9.3 Billion Hiroshima Fab Expansion, Targets HBM Shipments by Summer 2028

Micron Technology has officially started an expansion project at its wafer fab in Hiroshima, Japan, with total investment of about 1.5 trillion yen ($9.3 billion) to produce advanced memory chips including high-bandwidth memory (HBM) for AI processor demand, according to Jiemian News. The company expects related products to begin shipping around summer 2028. Japan’s Ministry of Economy, Trade and Industry will provide subsidies of up to about 500 billion yen for the project. Micron said the Hiroshima expansion is part of its global AI memory capacity buildout, alongside large-scale advanced-process investments underway in Idaho and New York to boost DRAM and HBM supply.