China's Ministry of Industry and Information Technology and China's National Development and Reform Commission have jointly issued the 15th Five-Year Plan for the electronics manufacturing industry, setting a target for revenue at large-scale firms to exceed 30 trillion yuan by 2030 and for R&D intensity to reach 3.5%, according to Jiemian News. The plan calls for breakthroughs across the integrated-circuit supply chain, including high-performance processors, high-density memory, high-reliability analog and mixed-signal chips, as well as faster development of electronic design automation tools and IP cores, and advances in 3D integration.
Jiemian News also cited Goldman Sachs as saying AI infrastructure investment will depend not only on cloud capex but also on the trend of custom AI chips replacing some GPU workloads. It said more chip types and higher design complexity will keep boosting demand for EDA software, creating about $3.7 billion in additional annual market opportunity by 2030, with benefits potentially emerging in the second half of 2026. Goldman Sachs added that the semiconductor equipment upcycle may last through 2028, with 2027 growth possibly rising to 45% from 36% in 2026, while memory supply tightness could persist through 2027.