Tsmc, Alphabet, Samsung Expand Capex as Changxin Technology Prepares Shanghai IPO

Taiwan Semiconductor Manufacturing Co. added $100 billion in U.S. investment and raised its full-year capital spending target to $60 billion-$64 billion, while Alphabet lifted AI capital expenditure to $195 billion-$205 billion and Samsung is reviewing a plan to double the initial scale of its Taylor, Texas plant, according to Jiemian News. SEMI said the global semiconductor equipment upcycle could last until 2028. Nvidia also prepaid $1.5 billion to Amkor to support the expansion of its U.S. advanced packaging capacity. Amkor's advanced packaging campus in Arizona carries a total investment of $7 billion and is expected to start production in 2028. Separately, Changxin Technology is set to list on the STAR Market on July 27, 2026, which Jiemian News said would make it the second-largest IPO in the board's history. Of the 29.5 billion yuan raised, more than 20 billion yuan will go to wafer fabrication line upgrades and DRAM research and development, while its three 12-inch fabs are targeting monthly output of 400,000 wafers. Jiemian News said the company's expansion is expected to lift demand for lithography, etching and testing equipment.