STOCKS | ASE Raises Advanced Chip Packaging Prices by More Than 20%

ASE, the world’s largest outsourced semiconductor assembly and test (OSAT) provider, announced on July 1 that it will raise packaging prices again, with increases of more than 20% at the high end. According to Odaily, the latest price hike covers multiple categories of advanced packaging technologies, including chip-on-wafer-on-substrate (CoWoS) and fan-out chip-on-substrate (FoCoS).